Peeling apparatus
AssigneeDisco Corporation
InventorsKazuyuki HINOHARA, Haruki MATSUO, Kazuya HIRATA, Ryohei YAMAMOTO
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Abstract
A peeling apparatus includes an ingot holding unit holding an ingot in a hanging state where a portion of the ingot to be peeled off as the wafer is directed downwardly, a water container containing water therein, an ultrasonic unit immersed in the water in the water container, a moving unit moving the ingot holding unit vertically into a position where the ingot holding unit faces the ultrasonic unit and at least the portion of the ingot to be peeled off as the wafer is immersed in the water in the water container, and a nozzle ejecting water to the portion of the ingot to be peeled off as the wafer thereby to promote the peeling of the wafer from the ingot.
Claims4
A peeling apparatus for peeling off a wafer from an ingot with a peel-off layer formed therein by applying a laser beam having a wavelength that is transmittable through the ingot to the ingot while a focal point of the laser beam is being positioned at a depth which corresponds to a thickness of the wafer to be peeled off, in the ingot, the peeling apparatus comprising:
- an ingot holding unit holding the ingot in a hanging state where a portion of the ingot to be peeled off as the wafer is directed downwardly;
- a water container containing water therein;
- an ultrasonic unit immersed in the water in the water container;
- a moving unit moving the ingot holding unit vertically into a position where the ingot holding unit faces the ultrasonic unit and at least the portion of the ingot to be peeled off as the wafer is immersed in the water in the water container;
- and
- a nozzle ejecting water to the portion of the ingot to be peeled off as the wafer thereby to promote the peeling of the wafer from the ingot.
Dependencies are inferred from the claim text.