Resin composition for film, film, film with base material, metal/resin laminate body, resin cured product, semiconductor device, and method for producing film

Abstract

Provided is a resin composition for a film, which is used for producing the film having excellent insulating properties and thermal conductivity. The provided resin composition for the film contains a thermosetting resin (A) and hexagonal boron nitride secondary agglomerated particles (B). Here, the hexagonal boron nitride secondary agglomerated particles (B) contains hexagonal boron nitride secondary agglomerated particles (B-1) having a cohesive breaking strength of 7 MPa or more and hexagonal boron nitride secondary agglomerated particles (B-2) having a cohesive breaking strength of 3 MPa or more and less than 7 MPa.

Dependencies are inferred from the claim text.