Molding processes for metallic foams, apparatuses, and products
AssigneeFourté International, SDN. BHD
InventorsJames J. Farquhar, Darryl G. McBride
Life of this patent
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Abstract
Embodiments of the present technology include molding processes for metallic foams, apparatuses, and products. An example method includes placing an uncompressed charge of conductive metal foam into a cavity disposed on a first tool, wherein the first tool is located on a first portion of a compression mold apparatus, translating the first portion of the compression mold apparatus towards a second portion of the compression mold apparatus so as to compress the uncompressed charge of conductive metal foam, creating a compressed charge of conductive metal foam, and overmolding around and through the compressed charge of conductive metal foam with an overmolding material.
Claims18
A method, comprising:
- placing an uncompressed charge of conductive metal foam into a cavity disposed on a first tool, wherein the core tool is located on a first portion of a compression mold apparatus;
- translating the first portion of the compression mold apparatus towards a second portion of the compression mold apparatus so as to compress the uncompressed charge of conductive metal foam, creating a compressed charge of conductive metal foam;
- and
- overmolding around and through the compressed charge of conductive metal foam with an overmolding material.
A system, comprising:
- a first tool located on a first portion of a compression mold apparatus, the first tool receiving a charge of conductive metal foam;
- a second portion of the compression mold apparatus configured to interface with the first tool of the compression mold apparatus;
- means for translating the second portion of the compression mold apparatus toward the first portion of the compression mold apparatus so as to capture the charge of conductive metal foam therebetween in such a way that a space is created between the first tool and the first portion of the compression mold apparatus;
- and
- means for filing the space with an overmolding material that integrates around and through the conductive metal foam into a overmolded product.
A method, comprising:
- placing charge of conductive metal foam into a mold cavity of a first tool, wherein the first tool is located on a first portion of a compression mold apparatus, further wherein the mold cavity is defined by a lower surface that comprises a plurality of pinch pins;
- translating the first portion of the compression mold apparatus into a second portion of the compression mold apparatus, the second portion comprising a second plurality of pinch pins that align with the plurality of pinch pins;
- wherein the second plurality of pinch pins and the plurality of pinch pins suspend the charge of conductive metal;
- and
- introducing an overmolding material into a space created by suspension of the charge of conductive metal, wherein the overmolding material saturates the charge of conductive metal foam.
Dependencies are inferred from the claim text.