Fusible material for three-dimensional molding
AssigneeKao Corporation
InventorsJouji HIRAI, Tadanori YOSHIMURA
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AssigneeKao Corporation
InventorsJouji HIRAI, Tadanori YOSHIMURA
Estimating the term…
A soluble material useful as a material of a support material supporting a three-dimensional object when manufacturing the three-dimensional object with a 3D printer of an FDM system; the soluble material contains a polyamide resin containing a hydrophilic monomer unit A having a hydrophilic group, a hydrophobic dicarboxylic acid monomer unit B, and a hydrophobic diamine monomer unit C, and a ratio of an amount of the hydrophilic monomer unit A to a total amount of monomer units in the polyamide resin is 2.5 mol % or more and less than 13.5 mol %. A soluble material useful as a support material, which is suitable for the production of a three-dimensional object by use of an FDM system and has moisture absorption resistance while the material is large in dissolution rate into any neutral water and removable speedily from a precursor of the three-dimensional object without using any aqueous strong alkaline solution.
A soluble material for three-dimensional modeling that is used as a material of a support material that supports a three-dimensional object when manufacturing the three-dimensional object with a 3D printer of a fused deposition modeling system, wherein
A support material that supports a three-dimensional object when manufacturing the three-dimensional object with a 3D printer of a fused deposition modeling system, wherein the support material contains a polyamide resin, the polyamide resin has a hydrophilic monomer unit A having a hydrophilic group, a hydrophobic dicarboxylic acid monomer unit B, and a hydrophobic diamine monomer unit C, and a ratio of an amount of hydrophilic monomer unit A to a total amount of monomer units in the polyamide resin is 2.5 mol % or more and less than 13.5 mol %.
Dependencies are inferred from the claim text.