Peeling apparatus
AssigneeDisco Corporation
InventorsKazuyuki HINOHARA, Ryohei YAMAMOTO
Life of this patent
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Abstract
A peeling apparatus includes: an ingot holding unit holding an ingot with an ingot portion corresponding to a wafer being faced up; an ultrasonic wave oscillating unit which has an end face facing the ingot portion corresponding to the wafer and oscillates an ultrasonic wave; a water supplying unit supplying water to an area between the ingot portion corresponding to the wafer and the end face of the ultrasonic wave oscillating unit; and a peeling unit that holds the ingot portion corresponding to the wafer with suction and peels off the wafer from the ingot.
Claims3
A peeling apparatus for peeling off a wafer from an ingot formed therein with a peel-off layer by applying a laser beam of such a wavelength as to be transmitted through the ingot to the ingot, with a focal point of the laser beam positioned at a depth corresponding to the thickness of the wafer, the peeling apparatus comprising:
- an ingot holding unit holding the ingot with an ingot portion corresponding to the wafer being faced up;
- an ultrasonic wave oscillating unit which has an end face facing the ingot portion corresponding to the wafer and which oscillates an ultrasonic wave;
- a water supplying unit supplying water to an area between the ingot portion corresponding to the wafer and the end face of the ultrasonic wave oscillating unit;
- and
- a peeling unit which holds the ingot portion corresponding to the wafer with suction and peels off the wafer from the ingot.
Dependencies are inferred from the claim text.