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US 2019/0160628 A1Published application
Method for conditioning polishing pad
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShen-Nan LEE, Te-Chien HOU, Teng-Chun TSAI, Chung-Wei HSU, Chen-Hao WU
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Abstract
A method is provided and includes: measuring a surface profile of a polishing pad; obtaining a reference profile of the polishing pad; comparing the surface profile of the polishing pad with the reference profile to generate a difference result; determining a conditioning parameter value according to the difference result; and conditioning the polishing pad using the conditioning parameter value.
Claims20
A method, comprising:
- measuring a surface profile of a polishing pad;
- obtaining a reference profile of the polishing pad;
- comparing the surface profile of the polishing pad with the reference profile of the polishing pad to generate a difference result;
- determining at least one conditioning parameter value according to the difference result;
- and
- conditioning the polishing pad using the at least one determined conditioning parameter value.
3 more elements
A method, comprising:
- measuring a surface profile of a polishing pad;
- calculating a difference between the measured surface profile of the polishing pad and a reference profile of the polishing pad;
- sweeping a conditioner across a surface of the polishing pad;
- and
- applying a downforce to the conditioner that urges the conditioner against the polishing pad based on the difference between the measured surface profile of the polishing pad and the reference profile of the polishing pad.
2 more elements
A method, comprising:
- measuring a surface profile of a polishing pad;
- calculating a difference between the measured surface profile of the polishing pad and a reference profile of the polishing pad;
- contacting a surface of the polishing pad with a conditioner;
- and
- sweeping the conditioner across the surface of the polishing pad at a sweeping speed value based on the difference between the measured surface profile of the polishing pad and the reference profile of the polishing pad.
2 more elements
Dependencies are inferred from the claim text.