Substrate processing apparatus

A non-transitory computer readable storage medium including an executable code causing a computer of a substrate processing apparatus for polishing a substrate by pressing the substrate against a polishing pad to execute:

• performing pressure feedback control by individually controlling pressures in a plurality of pressure chambers for pressing the substrate;
• measuring film thickness distribution of the substrate being polished;
• storing multiple pieces of information on a preset pressure of the pressure chambers;
• measuring polishing rate applied to the substrate by changing the preset pressure every time a predetermined condition is satisfied during polishing of the substrate, and
• acquiring response characteristic of the polishing of the substrate, wherein the response characteristic indicates responsiveness of the polishing of the substrate to the pressure feedback in the pressure chambers, the response characteristic being acquired on the basis of a plurality of the obtained polishing rates.

A method of acquiring a response characteristic of polishing of a substrate in a substrate processing apparatus polishing the substrate by pressing the substrate against a polishing pad, the method comprising the steps of:

• performing pressure feedback control by individually controlling pressures in a plurality of pressure chambers for pressing the substrate;
• measuring a film thickness distribution of the substrate being polished;
• storing multiple pieces of information on a preset pressure of the pressure chambers;
• and
• changing the preset pressure every time a predetermined condition is satisfied during polishing of the substrate, measuring a polishing rate applied to the substrate, and acquiring the response characteristic of the polishing of the substrate, wherein the response characteristic indicates responsiveness of the polishing of the substrate to the pressure feedback in the pressure chambers, the response characteristic being acquired on the basis of a plurality of the obtained polishing rates.