System, control method and apparatus for chemical mechanical polishing

The CMP apparatus of claim 6, further comprising:

• a second sensor, configured to measure a downward force that pushes the conditioner against the polishing pad;
• and
• a third sensor, configured to measure a cutting rate of the conditioner,
• wherein the at least one polishing condition is tuned according to the pad profile and at least one of the downward force and the cutting rate of the conditioner.

A control method of chemical mechanical polishing (CMP) apparatus having a polishing pad, a first sensor, a polishing head and a conditioner, the control method comprising:

• measuring, by the first sensor, a pad profile of the polishing pad, wherein the pad profile of the polishing pad includes depths of a plurality of grooves of the polishing pad;
• tuning at least one polishing condition according to the pad profile;
• polishing, by the polishing head, a wafer which is push against the polishing pad according to the at least one polishing condition;
• and
• reconditioning, by the conditioner, the polishing pad according to the at least one polishing condition.

A system, comprising:

• a chemical mechanical polishing (CMP) apparatus, comprising:
• a polishing pad that comprises a plurality of grooves on the polishing pad;
• a first sensor, configured to measure a pad profile of the polishing pad, wherein the pad profile of the polishing pad includes depths of the plurality of grooves;
• a polishing head, located above the polishing pad and configured to polish a wafer which is push against the polishing pad according to the pad profile;
• and
• a conditioner, located above the polishing pad and configured to recondition the polishing pad according to the pad profile;
• a memory, configured to store program instructions;
• and
• a controller, coupled to the memory and the CMP apparatus, and is configured to execute the program instructions stored in the memory to:
• tune at least one polishing condition according to the pad profile of the polishing pad;
• and
• control the polishing head and the conditioner according to the at least one polishing condition.