Electronic-component inserting device

An electronic-component inserting device configured to insert an electronic component with leads into through-holes of a substrate, comprising:

• a component gripper configured to hold a main body of the electronic component;
• an operating member provided to the component gripper;
• a lead gripper configured to grip the leads of the electronic component held by the component gripper;
• and
• a moving device configured to move the component gripper in a first direction relatively to the lead gripper,
• wherein the lead gripper has a pair of fingers configured to pinch the leads from both sides in second directions perpendicular to the first direction, and a biasing member configured to bias the pair of fingers so that fingertips of the fingers are opened, and
• wherein the fingers are provided with acted parts on which an acting force from the operating member acts so that the fingertips of the fingers are closed.