Passive nano-heat pipes for cooling and thermal management of electronics and power conversion devices
AssigneeSyracuse University
InventorsShalabh C. Maroo, An Zou, Manish Gupta
Life of this patent
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Abstract
A cooling device for a heat source, such as an electronic component, has a single or set of nano- and/or micro-sized channel(s) connected to a single or multiple reservoir(s). The heat source causes nucleation within a channel, and a vapor bubble forms removing heat from the heat source via evaporation of liquid to vapor in the bubble and condensation of the generated vapor at the cooler ends of the bubble. Thus, the channel operates as a passive heat pipe and removes heat from the source by passively circulating the cooling fluid between the vapor bubble and the reservoir(s).
Claims17
A device for providing cooling to an electronic component, comprising:
- a substrate having at least one channel formed therein;
- at least one reservoir positioned at an end of and in fluid communication with the channel;
- and
- a coolant capable of a reversible liquid to vapor transition positioned in the channel.
A method of cooling an electronic component, comprising the steps of:
- providing a cooling device including a substrate having at least one channel formed therein, at least one reservoir positioned at an end of and in fluid communication with the channel, and a coolant capable of a reversible liquid to vapor transition positioned in the channel, wherein the cooling device is positioned along the electronic device so that a heat source of the electronic device is operatively coupled to the channel of the cooling device.
Dependencies are inferred from the claim text.