Housing and method for fabrication thereof and application thereof
OwnerJian SUN, Liang CHEN +4inventors
InventorsJian SUN, Liang CHEN, Guiwang ZHAO, Yingyuan WU, Xiangrong JIANG, Yunfei ZOU
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Abstract
The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal hard anodic oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal hard anodic oxide layer (5). The metal hard anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing hard anode oxidization treatment on a metal substrate (1), and then successively performing injection molding and etching.
Claims19
A housing, comprising a metal hard anodic oxide layer and a resin film layer adhering to a first surface of the metal hard anodic oxide layer, wherein the metal hard anodic oxide layer and the resin film layer form an integrated structure.
A housing preparation method, comprising:
- providing a metal substrate, and performing hard anode oxidization treatment on the metal substrate, to obtain a base having a metal hard anodic oxide;
- forming a resin film layer on a first surface of the base, to obtain a first composite;
- performing alkaline etching on the first composite, to remove, from a surface of the base, a metal hard anodic oxide (2) on which a resin film layer is not formed, to obtain a second composite, wherein the second composite comprises the metal substrate, the metal hard anodic oxide layer, and the resin film layer;
- and
- performing acidic etching on the second composite, to remove the metal substrate from the base.
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Dependencies are inferred from the claim text.