Multilayer board and method of manufacturing the same
AssigneeMurata Manufacturing Co., Ltd.
InventorsShingo ITO, Kanto IIDA, Naoki GOUCHI
Life of this patent
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Abstract
A method of manufacturing a multilayer board includes forming conductor patterns on four or more insulating base material layers, forming a multilayer body by stacking the insulating base material layers in a state in which the conductor patterns face each other with prepreg layers therebetween, and heat-pressing the multilayer body. In a state before the step of heat-pressing, among the prepreg layers, a thickness of an outermost prepreg layer is larger than a thickness of a prepreg layer other than the outermost prepreg layer.
Claims12
A method of manufacturing a multilayer board, comprising:
- a step of forming conductor patterns on four or more insulating base material layers;
- a step of forming a multilayer body by stacking the insulating base material layers in a state in which the conductor patterns face each other with a plurality of prepreg layers therebetween and in which the conductor patterns that face each other with the prepreg layers therebetween include portions that overlap at a same or substantially same position as viewed in a stacking direction of the insulating base material layers and the prepreg layers;
- and
- a step of heat-pressing the multilayer body;
- wherein
- in a state before the step of heat-pressing, among the plurality of prepreg layers, a thickness of an outermost prepreg layer is larger than a thickness of a prepreg layer other than the outermost prepreg layer.
A multilayer board comprising:
- four or more insulating base material layers;
- conductor patterns provided on the insulating base material layers;
- and
- a plurality of prepreg layers that join the insulating base material layers to each other;
- wherein
- the conductor patterns are provided on surfaces of the insulating base material layers that contact both surfaces of an outermost prepreg layer among the plurality of prepreg layers;
- among the plurality of prepreg layers, a thickness of the outermost prepreg layer is larger than a thickness of an inner prepreg layer other than the outermost prepreg layer;
- the conductor patterns that contact both surfaces of the outermost prepreg layer face each other with the outermost prepreg layer therebetween;
- the conductor patterns that contact both surfaces of the inner prepreg layer face each other with the inner prepreg layer therebetween;
- and
- the conductor patterns that face each other with the outermost prepreg layer therebetween and the conductor patterns that face each other with the inner prepreg layer therebetween include portions that overlap at a same or substantially same position as viewed in a stacking direction of the insulating base material layers and the prepreg layers.
Dependencies are inferred from the claim text.