Methods for producing ceramic substrates and module components
AssigneeMurata Manufacturing Co., Ltd.
InventorMasashi MATSUBARA
Life of this patent
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Abstract
In a method for manufacturing ceramic substrates and module components, an unfired mother ceramic substrate is cut at predetermined positions for division into separate unfired ceramic substrates. The cut unfired mother ceramic substrate is pressed such that pressure is applied parallel or substantially parallel to its main surfaces so that the cross-sectional end surfaces created in the cutting step are joined. The unfired mother ceramic substrate including end surface junctions, resulting from joining of the cross-sectional end surfaces, is fired. The fired mother ceramic substrate is broken along the end surface junctions to divide it into separate ceramic substrates.
Claims10
A method for producing module components that are produced by dividing a mother ceramic substrate with surface mount devices thereon at a predetermined position into a plurality of separate ceramic substrates, the method comprising:
- a cutting step in which an unfired mother ceramic substrate that has yet to be fired is cut at a predetermined position from one main surface through to the other main surface to divide the unfired mother ceramic substrate into separate unfired ceramic substrates;
- a pressing step in which the cut unfired mother ceramic substrate is pressed to apply pressure in a direction parallel or substantially parallel to the main surfaces thereof so that cross-sectional end surfaces created in the cutting step are joined, combining the separate unfired ceramic substrates into a single unit;
- a firing step in which the unfired mother ceramic substrate including an end surface junction, which is an area resulting from joining the cross-sectional end surfaces, is fired;
- a device-mounting step in which one of the surface mount devices is mounted to each of the separate fired ceramic substrates in the fired mother ceramic substrate;
- and
- a dividing step in which the fired mother ceramic substrate, with a respective one of the surface mount devices on each of the separated fired ceramic substrates, is broken along the end surface junction to divide the mother ceramic substrate into separate module components each including a respective one of the separate ceramic substrates and the surface mount device thereon.
Dependencies are inferred from the claim text.