Motherboard To Be Cut, Method Of Manufacturing Substrate And Method Of Detecting Cutting Accuracy Of Substrate

A motherboard to be cut, comprising:

• a motherboard body provided, on a surface thereof, with a cutting line comprising a special-shaped cutting line section, wherein,
• a plurality of positional marker groups are provided on a portion of the surface where the special-shaped cutting line section is provided, and the plurality of positional marker groups are distributed in an extension direction where the special-shaped cutting line section is in;
• each of the plurality of positional marker groups comprises a first marker assembly provided at one side of the special-shaped cutting line section and a second marker assembly provided at the other side of the special-shaped cutting line section;
• a space for passing the special-shaped cutting line section therethrough is provided between the first marker assembly and the second marker assembly;
• the first marker assembly and the second marker assembly each comprise scale marks distributed in an arrangement direction of the first marker assembly and the second marker assembly;
• and, in the arrangement direction of the first marker assembly and the second marker assembly, a size of the first marker assembly is not less than a tolerance size of a side of the special-shaped cutting line section where the first marker assembly is in when the special-shaped cutting line section is cut, and a size of the second marker assembly is not less than a tolerance size of a side of the special-shaped cutting line section where the second marker assembly is in when the special-shaped cutting line section is cut.