Electronic substrate having differential coaxial vias

A method of manufacturing an electronic substrate, comprising:

• forming at least one differential coaxial through-via in a dielectric core having a first conducting layer on a first side of said dielectric core and a second conducting layer on a second side of said dielectric core opposite said first side, comprising:
• forming an annular-shaped outer through-via pattern extending from said first side to said second side;
• conductor lining said annular-shaped outer through-via pattern;
• filling said annular-shaped outer through-via pattern with a dielectric material or high electrically resistive material to complete an outer ground shield enclosure;
• forming through-holes through said dielectric material including a first and a second inner signal through-hole via, and
• at least lining said first and second inner through-hole vias with a conductive material to form first and second inner signal through-vias that couple from said first electrically conducting layer to said second conducting layer.

An integrated circuit (IC) assembly, comprising:

• a dielectric core;
• a first conducting layer on a first side of said dielectric core and a second conducting layer on a second side of said dielectric core opposite said first side;
• at least one differential coaxial through-via, comprising:
• a first inner signal through-via that is at least conductor lined for a first signal path;
• at least a second inner signal through-via that is at least conductor lined positioned side-by-side and being dielectrically isolated from said first inner signal through-via for a second signal path, and
• an annular-shaped outer ground shield enclosure comprising at least one conductor extending from said first side to said second side, wherein said ground shield enclosure surrounds and is dielectrically isolated from both said first inner signal through-via and said second inner signal through-via, and
• an IC die coupled to said first inner signal through-via, said second inner signal through-via, and said conductor of said outer ground shield enclosure on said first side of said dielectric core.