High frequency circuit

A high frequency circuit (1A;

• 1B) comprising:
• a substrate (2) that includes
• a first dielectric layer (5) having an opening (5b) which penetrates the first dielectric layer (5) in a layer thickness direction,
• second dielectric layers (6) laminated on a lower surface and an upper surface of the first dielectric layer (5), and
• a plurality of conductor layers (4a-4h) provided in the first dielectric layer (5) and the second dielectric layer (6);
• a first high frequency device (3) that is placed within the opening (5b), the first high frequency device (3) being installed such that
• a device back surface (3b) opposite a terminal surface (3a) is thermally and closely connected to a conductor layer for heat dissipation (4g) out of the plurality of conductor layers (4a-4h), the conductor layer for heat dissipation (4g) provided at the lower surface side of the first dielectric layer (5), and
• terminals (9a, 9b, 9c) on the terminal surface (3a) are electrically connected to terminal conductor layers (4a, 4b, 4h) out of the plurality of conductor layers (4a-4h) through a first via hole (8) provided in the second dielectric layer (6), the terminal conductor layer (4a, 4b, 4h) being formed on the upper surface side of the first dielectric layer (5);
• and
• a second high frequency device (11) that is installed such that a terminal surface thereof (11a) faces a surface layer of the upper surface side of the first dielectric layer (5) in the substrate (2) and that terminals (12a-12e) on the terminal surface (11a) are electrically connected to terminal conductor layers (4a, 4k, 4j, 4i),
• wherein the first/second high frequency devices (3, 11) are disposed at different positions in a planar direction on the substrate (2), and
• wherein, in each of the first/second high frequency devices (3, 11), signal terminals (9a/9b;
• 12a/12d) are separated by a ground terminal (9c;
• 12c).