Mems packaging
AssigneeCirrus Logic International Semiconductor Ltd.
InventorsRkia ACHEHBOUNE, Dimitris DROGOUDIS, Roberto BRIOSCHI, Aleksey Sergeyevich KHENKIN, David PATTEN
Life of this patent
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Abstract
A package for a MEMS device, the package comprising a MEMS transducer within a chamber of the package; and a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber; wherein the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.
Claims22
A package for a MEMS device, the package comprising:
- a MEMS transducer within a chamber of the package;
- and
- a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber;
- wherein
- the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.
A package for a MEMS device, the package comprising:
- a package substrate comprising an upper surface and a lower surface, the upper surface being at least partly in contact with a chamber of the package in use;
- wherein
- the package substrate comprises a filter circuit for filtering RF signals and wherein a resistor of the filter circuit is formed on, or within, a layer forming the lower surface of the package.
A package for a MEMS device comprising
- a substrate comprising a plurality of layers, wherein a first layer of the substrate forms at least a part of an interior surface of a chamber of the package and wherein a second layer of the substrate forms at least a part of an exterior surface of the package,
- the package substrate comprising a resistor of a filter circuit, wherein the resistor is provided on or in the second layer.
-21. (canceled)
-24. (canceled)
Dependencies are inferred from the claim text.