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US 2019/0158510 A1Published application
Monolithic Three-Dimensional Pattern Processor
AssigneeHangZhou HaiCun Information Technology Co., Ltd.
InventorGuobiao ZHANG
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Abstract
A monolithic three-dimensional (3-D) pattern processor comprises a plurality of storage-processing units (SPU's). Each of the SPU's comprises at least a 3-D memory (3D-M) array and a pattern-processing circuit. The 3D-M could be a horizontal 3D-M (3D-MH) or a vertical 3D-M (3D-MV). The 3D-M array stores patterns; the pattern-processing circuit processes these patterns; and, they are communicatively coupled by a plurality of intra-die connections.
Claims20
A monolithic three-dimensional (3-D) pattern processor, comprising a semiconductor substrate having transistors thereon;
- an input for transferring at least a first portion of a first pattern;
- a plurality of storage-processing units (SPU's) communicatively coupled with said input, each of said SPU's comprising:
- at least a 3-D memory (3D-M) array for storing at least a second portion of a second pattern;
- a pattern-processing circuit for performing pattern processing for said first and second patterns;
- wherein said pattern-processing circuit is disposed on said semiconductor substrate;
- said 3D-M array is stacked above said pattern-processing circuit;
- and, said 3D-M array and said pattern-processing circuit are communicatively coupled by a plurality of intra-die connections.
4 more elements
Dependencies are inferred from the claim text.