Production method for el device

A production method for an EL device including a base layer, a light-emitting element layer, a plurality of terminals, and an electronic circuit board mounted on the plurality of terminals;

• the production method comprising:
• a preparation step of directly or indirectly applying heat and pressure to a prescribed region including the plurality of terminals without any overlap between the plurality of terminals and the electronic circuit board;
• and
• a thermocompression bonding step of thermocompression-bonding the plurality of terminals and the electronic circuit board,
• wherein the base layer has flexibility,
• the base layer includes a resin layer and a lower face film, and
• after the resin layer, a barrier layer, a TFT layer, the light-emitting element layer, and a sealing layer are formed on an upper face side of a support, the support is peeled from the resin layer, and the lower face film is adhered to a lower face of the resin layer.