US 2019/0157612 A1 · ENCAPSULATION FILM

Abstract

The present application relates to an encapsulation film, a method of manufacturing the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. The present application provides an encapsulation film which can be formed to have a structure in which moisture or oxygen flowing from the outside into an organic electronic device can be effectively blocked, has excellent handling properties and processability, and also has excellent bonding properties with an organic electronic element and durability.

Claims20

Dependent claims

An encapsulation film comprising:

a metal layer having a first surface and a second surface opposite to the first surface;
and
an encapsulation layer provided on the first surface and positioned inside an edge of the first surface so that a predetermined gap is formed between an edge of the encapsulation layer and the edge of the first surface, and
satisfying the following General Equation 1:
0.95≤a/b≤25 [General Equation 1]
wherein “a” is a size of the gap and b is a thickness of the encapsulation layer.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

16/091,394Filed 12 Apr 2017

Priority

KR 10-2016-004451912 Apr 2016

Published

23 May 2019

Term ends

Not estimatedThe source records don’t support an estimate.

Classification54 codes

B32B 7/12
Interconnection of layers: using interposed adhesives or interposed materials with bonding properties
B32B 3/02
Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products…:…
B32B 3/26
Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products…:…
B32B 3/263
Characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or…

Encapsulation film

Life of this patent

Encapsulation film

Life of this patent

Abstract

Claims20