Method for thin-film via segments in photovoltaic device
AssigneeFlisom AG
InventorsRoger ZILTENER, Thomas NETTER
Life of this patent
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AssigneeFlisom AG
InventorsRoger ZILTENER, Thomas NETTER
Estimating the term…
A method for vias and monolithic interconnects in thin-film optoelectronic devices in which at least one line segment via hole is formed by laser drilling and passes through front-contact layers and semiconductive active layer, and in which laser drilling causes forming a CIGS-type wall of electrically conductive permanently metalized copper-rich CIGS-type alloy at the inner surface of the via hole, forming a conductive path between at least a portion of front-contact and a portion of back-contact layers, forming a bump-shaped raised portion at the surface of the front-contact layer, forming a raised portion of the back-contact layer, and optionally forming a raised portion of copper-rich CIGS-type alloy covering a portion of the front-contact layer. A thin-film CIGS device includes at least one line segment via hole obtainable by the method.
1-20. (canceled)
A photovoltaic cell comprising:
A photovoltaic device comprising a plurality of photovoltaic cells, each photovoltaic cell comprising:
A photovoltaic device comprising a plurality of photovoltaic cells including a first photovoltaic cell and a second photovoltaic cell, each photovoltaic cell comprising:
Dependencies are inferred from the claim text.