Encapsulation cover for an electronic package and fabrication process
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorsKarine SAXOD, Veronique FERRE, Agnes BAFFERT, Jean-Michel RIVIERE
Life of this patent
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Abstract
An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.
Claims35
An encapsulation cover for an electronic package, comprising:
- a cover body;
- a metal insert that is embedded in the cover body, the cover body being overmolded over the metal insert;
- wherein the cover body and embedded metal insert form a frontal wall having a through-passage from a first face to a second face, the cover body further including a peripheral wall that protrudes from the second face of the frontal wall;
- and
- an optical element located within the through-passage and configured to allow light to pass through the through-passage.
An electronic package, comprising:
- a substrate wafer;
- an electronic component, including at least one of an optical sensor or an optical emitter, mounted on top of a face of the substrate wafer;
- and
- an encapsulation cover mounted on said face of the substrate wafer so as to form a chamber in which the electronic component is located, wherein the encapsulation cover comprises:
- a cover body;
- a metal insert that is embedded in the cover body, the cover body being overmolded over the metal insert;
- wherein the cover body and embedded metal insert form a frontal wall having a through-passage from a first face to a second face, the cover body further including a peripheral wall that protrudes from the second face of the frontal wall and is mounted to said face of the substrate wafer;
- and
- an optical element located within the through-passage and configured to allow light to pass through the through-passage;
- wherein the frontal wall is positioned in front of the electronic component with the through-passage aligned with the optical sensor or an optical emitter of the electronic component.
A process for fabricating at least one encapsulation cover for an electronic package, comprising the following steps:
- placing, into a cavity defined between opposite faces of two parts of a mold, at least one optical element through which light is able to pass and at least one metal insert, the optical element and the metal insert making contact with a first face of the opposite faces of the mold and the optical element making contact with a second face of the opposite faces of the mold;
- injecting a coating material into a remaining space of the cavity;
- hardening the coating material to obtain a wall that is overmolded over said at least one optical element and said at least one metal insert, so as to produce at least one encapsulation cover including the at least one metal insert and the at least one optical element and in which said at least one optical element allows light to pass through from one face to another face of said wall;
- and
- removing said produced encapsulation cover from the mold.
An encapsulation cover for an electronic package, comprising:
- a cover body;
- a metal insert that is embedded in the cover body, the cover body being overmolded over the metal insert;
- wherein the cover body forms at least part of a frontal wall;
- wherein the embedded metal insert includes opposed walls;
- and
- a metal portion that extends between the opposed walls of the embedded metal insert parallel to a front surface of the frontal wall.
Dependencies are inferred from the claim text.