Led filament comprising conversion layer
AssigneeOSRAM Opto Semiconductors GmbH
InventorsReiner Windisch, Florian Bösl, Andreas Dobner, Matthias Sperl
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AssigneeOSRAM Opto Semiconductors GmbH
InventorsReiner Windisch, Florian Bösl, Andreas Dobner, Matthias Sperl
Estimating the term…
An LED filament includes semiconductor chips arranged on a top side of a radiation-transmissive carrier, and at least partly covered with a radiation-transmissive first layer, the first layer and an underside of the carrier are covered with a second layer, phosphor is provided in the second layer, the phosphor is configured to shift a wavelength of the radiation of the semiconductor chip, no phosphor or phosphor including less than 50% of the concentration of the phosphor of the second layer is provided in the first layer, the carrier is formed from a further first layer and a carrier layer having cutouts, the carrier layer is arranged on the further first layer, the semiconductor chips are arranged on the further first layer in the regional of the cutouts of the carrier layer, and the first layer and the further first layer are at least partially covered with the second layer.
1-20. (canceled)
An LED filament comprising radiation-emitting semiconductor chips, wherein the semiconductor chips are arranged on a top side of a radiation-transmissive carrier, the semiconductor chips and a top side of the carrier are at least partly covered with a radiation-transmissive first layer, the first layer and an underside of the carrier are covered with a second layer, phosphor is provided in the second layer, the phosphor is configured to shift a wavelength of the radiation of the semiconductor chip, no phosphor or phosphor comprising less than 50% of the concentration of the phosphor of the second layer is provided in the first layer, the carrier is formed from a further first layer and a carrier layer having cutouts, the carrier layer is arranged on the further first layer, the semiconductor chips are arranged on the further first layer in the regional of the cutouts of the carrier layer, and the first layer and the further first layer are at least partially covered with the second layer.
Dependencies are inferred from the claim text.