Optoelectronic component and method of producing an optoelectronic component
AssigneeOSRAM Opto Semiconductors GmbH
InventorPeter Nagel
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Abstract
An optoelectronic component includes a carrier including a mounting face, wherein at least one optoelectronic semiconductor chip configured to emit electromagnetic radiation is arranged above the mounting face, a molding material is arranged above the mounting face, the optoelectronic semiconductor chips are embedded into the molding material, a cavity is formed in the molding material, the cavity is empty, radiation emission faces of the optoelectronic semiconductor chips are not covered by the molding material, the cavity is accessible through an opening in the molding material, and an opening face of the opening is smaller than a sum of all radiation emission faces of the optoelectronic semiconductor chips.
Claims14
An optoelectronic component comprising a carrier comprising a mounting face,
- wherein at least one optoelectronic semiconductor chip configured to emit electromagnetic radiation is arranged above the mounting face,
- a molding material is arranged above the mounting face,
- the optoelectronic semiconductor chips are embedded into the molding material,
- a cavity is formed in the molding material,
- the cavity is empty,
- radiation emission faces of the optoelectronic semiconductor chips are not covered by the molding material,
- the cavity is accessible through an opening in the molding material, and
- an opening face of the opening is smaller than a sum of all radiation emission faces of the optoelectronic semiconductor chips.
A method of producing an optoelectronic component comprising:
- providing a carrier comprising a mounting face;
- arranging at least one optoelectronic semiconductor chip configured to emit electromagnetic radiation above the mounting face of the carrier;
- arranging a sacrificial body of salt above the radiation emission faces of the optoelectronic semiconductor chips;
- arranging and curing a molding material above the mounting face of the carrier, wherein the optoelectronic semiconductor chips and the sacrificial body are embedded into the molding material;
- and
- removing the sacrificial body, wherein an empty cavity comprising a geometric shape corresponding to the sacrificial body remains in the molding material, and an opening is produced in the molding material, wherein the cavity is accessible through the opening.
Dependencies are inferred from the claim text.