Interconnect structure with redundant electrical connectors and associated systems and methods
AssigneeMicron Technology, Inc.
InventorAnilkumar Chandolu
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Abstract
Semiconductor die assemblies having interconnect structures with redundant electrical connectors are disclosed herein. In one embodiment, a semiconductor die assembly includes a first semiconductor die, a second semiconductor die, and an interconnect structure between the first and the second semiconductor dies. The interconnect structure includes a first conductive film coupled to the first semiconductor die and a second conductive film coupled to the second semiconductor die. The interconnect structure further includes a plurality of redundant electrical connectors extending between the first and second conductive films and electrically coupled to one another via the first conductive film.
Claims17
A semiconductor device, comprising:
- a semiconductor substrate;
- a dielectric material over the substrate;
- a conductive trace extending at least partially through the dielectric material;
- and
- a plurality of redundant electrical connectors extending from the conductive trace and through at least a portion of the dielectric material, wherein each of the redundant electrical connectors includes—
- a conductive member coupled to the conductive trace, and
- a conductive bond material bonded to the conductive member,
- wherein all of the redundant electrical connectors are coupled to the conductive trace.
A semiconductor device, comprising:
- a semiconductor die;
- a conductive film over and electrically coupled to the semiconductor die;
- a dielectric material over the semiconductor die and at least partially covering the conductive film, wherein a plurality of openings extend at least partially through the dielectric material to the conductive film;
- and
- a plurality of redundant electrical connectors directly on the conductive film, wherein each of the redundant electrical connectors extends through portions of the dielectric film and is positioned within the openings, and wherein each of the redundant electrical connectors is electrically coupled to each of the other redundant electrical connectors via the conductive film.
Dependencies are inferred from the claim text.