Apparatus and method for multi-die interconnection
AssigneeCerebras Systems Inc.
InventorsJean-Philippe Fricker, Philip Ferolito
Life of this patent
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Abstract
A semiconductor and a method of fabricating the semiconductor having multiple, interconnected die including: providing a semiconductor substrate having a plurality of disparate die formed within the semiconductor substrate, and a plurality of scribe lines formed between pairs of adjacent die of the plurality of disparate die; and fabricating, by a lithography system, a plurality of inter-die connections that extend between adjacent pair of die of the plurality of die.
Claims19
A semiconductor having multiple, interconnected die, the semiconductor comprising:
- a semiconductor substrate;
- a plurality of die fabricated within the semiconductor substrate by one or more lithography processes applied to the semiconductor substrate;
- a circuit layer formed at each of the plurality of die;
- a plurality of inter-die connections that communicatively connect disparate die of the plurality of die formed within the semiconductor substrate, wherein each of the plurality of inter-die connections extends between pairs of disparate die of the plurality of die.
A method of fabricating a semiconductor having multiple, interconnected die, the method comprising:
- providing a semiconductor substrate having:
- a plurality of disparate die formed by one or more lithography processes within the semiconductor substrate, and
- a plurality of scribe lines that uncut formed between pairs of adjacent die of the plurality of disparate die;
- and
- fabricating, by a lithography system, a plurality of inter-die connections that extend between pairs of die of the plurality of die.
Dependencies are inferred from the claim text.