Batch Manufacture of Component Carriers
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsHeinz Moitzi, Dietmar Drofenik
Life of this patent
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Abstract
A method of manufacturing a batch of component carriers is disclosed. The method includes providing a plurality of separate wafer structures, each comprising a plurality of electronic components, simultaneously laminating the wafer structures with at least one electrically conductive layer structure and at least one electrically insulating layer structure, and singularizing a structure resulting from the laminating into the plurality of component carriers, each comprising at least one of the electronic components, a part of the at least one electrically conductive layer structure and a part of the at least one electrically insulating layer structure.
Claims25
A method of manufacturing a batch of component carriers, the method comprising:
- providing a plurality of separate wafer structures each comprising a plurality of electronic components;
- simultaneously laminating the wafer structures with at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- singularizing a structure resulting from the laminating into the plurality of component carriers, each comprising at least one of the electronic components, a part of the at least one electrically conductive layer structure and a part of the at least one electrically insulating layer structure.
A method of manufacturing a batch of component carriers, the method comprising:
- arranging a plurality of separate electronic components, configured as bare dies with pads, on a common panel,
- the electronic components and at least one electrically conductive layer structure and at least one electrically insulating layer structure to thereby form a redistribution layer on the bare dies;
- and
- singularizing a structure resulting from the laminating into the plurality of component carriers, each comprising a part of the panel, at least one of the electronic components, a part of the at least one electrically conductive layer structure and a part of the at least one electrically insulating layer structure.
-14. (canceled)
-17. (canceled)
A semifinished product, comprising a laminate of:
- a base structure comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- a plurality of separate wafer structures, each comprising a plurality of electronic components, arranged on the base structure;
- and
- a cover structure comprising at least one further electrically conductive layer structure and/or at least one further electrically insulating layer structure and being arranged to cover the wafer structures and part of the base structure.
-22. (canceled)
A semifinished product, comprising a laminate of:
- a base structure having a common panel comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- a plurality of separate electronic components, configured as bare dies with pads, on the common panel;
- and
- a cover structure comprising at least one further electrically conductive layer structure and/or at least one further electrically insulating layer structure and being arranged to cover the electronic components and part of the base structure;
- wherein at least part of the one or more electrically conductive layer structures and/or at least part of the one or more electrically insulating layer structures form a redistribution layer on the bare dies.
-28. (canceled)
A component carrier, comprising:
- a base laminate comprising a laminated stack of at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- a cover laminate comprising a laminated stack of at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- a bare die with pads, wherein the bare die is laminated between the base laminate and the cover laminate and has a lateral semiconductor surface being exposed from the base laminate and the cover laminate.
-32. (canceled)
A component carrier, comprising:
- a base structure comprising at least one electrically conductive layer structure) and/or at least one electrically insulating layer structure;
- a cover structure comprising a laminated stack of at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- and
- at least two vertically stacked electronic components laminated between the base structure and the cover structure.
Dependencies are inferred from the claim text.