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US 2019/0157241 A1Published application
Method of manufacturing semiconductor device
AssigneeToyota Jidosha Kabushiki Kaisha
InventorsSatoru TAKEMOTO, Kazumi SERIZAWA
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Abstract
A method of manufacturing a semiconductor device may include interposing a bonding material between an electrode of a semiconductor element and a conductor, the bonding material being a material that is to be melted by heat; melting the bonding material by applying a current to the semiconductor element to cause the semiconductor element to generate heat; and cooling and solidifying the bonding material that is melted by stopping the current.
Claims4
A method of manufacturing a semiconductor device comprising:
- interposing a bonding material between an electrode of a semiconductor element and a conductor, the bonding material being a material that is to be melted by heat;
- melting the bonding material by applying a current to the semiconductor element to cause the semiconductor element to generate heat;
- and
- cooling and solidifying the bonding material that is melted by stopping the current.
1 more element
Dependencies are inferred from the claim text.