Semiconductor device and method for manufacturing semiconductor device
AssigneeRohm Co., Ltd.
InventorsAKIHIRO KIMURA, TAKESHI SUNAGA
Life of this patent
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Abstract
A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.
Claims20
A semiconductor device, comprising:
- a plurality of terminals, each having an upper surface and a lower surface;
- a first semiconductor element placed to overlap with the upper surfaces of the plurality of terminals;
- a resin package that covers at least the upper surfaces of the plurality of terminals and the semiconductor element;
- a conductive member,
- wherein the semiconductor element includes at least one electrode corresponding to one of the plurality of terminals,
- the conductive member contacts both the one electrode and the one of the plurality of terminals,
- the conductive member includes a conductive columnar member, and a fixing member surrounding the conductive columnar member and spreading on a surface of the one of the plurality of terminals, the fixing member being made of a melted material and formed along a side face of the conductive columnar member from a bottom of the conductive columnar member,
- a thickness of the fixing member on a first end thereof is smaller than a thickness of the fixing member proximate the conductive columnar member on a second end opposite to the first end.
A semiconductor device, comprising:
- at least one terminal having an upper surface and a lower surface;
- a semiconductor element having a plurality of electrodes on a first surface;
- at least one conductive columnar member interfaced with at least one of the electrodes and extending outward from and perpendicular to the first surface of the semiconductor element;
- and
- a fixing material that is provided over the one terminal and changeable from a solid phase to a liquid phase,
- wherein the conductive columnar member conductively contacts the at least one terminal on the upper surface thereof through the fixing material, the fixing material extending up along a side face of the conductive columnar member and securing the conductive columnar member to the one terminal;
- a thickness of the fixing material on one end thereof is smaller than a thickness of the fixing material on a second end thereof proximate the conductive columnar member and opposite to the one end, and the one end and the second end of the fixing material are interlinked with a curved surface of the fixing material.
Dependencies are inferred from the claim text.