Packages for Semiconductor Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChing-Jung Yang, Yen-Ping Wang
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Abstract
Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes an integrated circuit die mounting region, a molding material around the integrated circuit die mounting region, and an interconnect structure over the molding material and the integrated circuit die mounting region. The interconnect structure has contact pads, and connectors are coupled to the contact pads. Two or more of the connectors have an alignment feature formed thereon.
Claims20
A method of packaging a semiconductor device, the method comprising:
- providing a packaged semiconductor device including an integrated circuit die disposed in a molding material and an interconnect structure disposed over the integrated circuit die and the molding material, the interconnect structure comprising a plurality of contact pads;
- providing a plate comprising a plurality of connector patterns disposed thereon, two or more of the plurality of connector patterns including an alignment pattern disposed thereon;
- and
- forming a connector material in the plurality of connector patterns of the plate, wherein forming the connector material comprises forming a plurality of first connectors and a plurality of second connectors in the plurality of connector patterns of the plate, wherein the plurality of first connectors each comprises an alignment feature disposed thereon, and wherein the alignment features of the plurality of first connectors are formed from the alignment patterns of the two or more of the plurality of connector patterns on the plate.
A method of packaging a semiconductor device, the method comprising:
- forming a first connector in a first recess of a connector plate, the first recess having a first pattern shape at a bottom thereof;
- forming a second connector in a second recess of the connector plate, the second recess lacking the first pattern shape at a bottom thereof;
- transferring the first connector and the second connector to a first package device, the first connector comprising an alignment feature corresponding to the first pattern shape;
- aligning a second package device to the first package device based on a position of the alignment feature of the first connector;
- and
- bonding the second package device to the first package device by the second connector.
A method comprising:
- patterning a plate to form a first set of connector patterns and a second set of connector patterns, wherein each of the first set of connector patterns and second set of connector patterns comprise a cavity, wherein the first set of connector patterns further comprises an alignment pattern formed at a bottom of each cavity at a depth greater than a depth of the second set of connector patterns;
- filling each of the cavities with an eutectic material to form first connectors and second connectors, the first connectors corresponding to the first set of connector patterns, the first connectors each comprising an alignment pattern formed thereon, the second connectors corresponding to the second set of connector patterns;
- transferring the first connectors and second connectors to respective contact pads of a first package;
- and
- bonding one or more of the first or second connectors to a second package.
Dependencies are inferred from the claim text.