Semiconductor devices having wire bonding structures and methods of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYong Je LEE, Seunglo LEE, Sungil CHO, Hosoo HAN
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Abstract
A semiconductor device includes a first device having a first pad; a second device having a second pad; and a bonding wire electrically connecting the first device and the second device to each other via the first pad and the second pad. The bonding wire includes: a first bonding structure provided at a first end of the bonding wire, electrically connected to the first device and includes: a first ball bonding region; and a first stitch bonding region; and a second bonding structure provided at a second end opposite of the first end of the bonding wire and electrically connected to the second device.
Claims19
A semiconductor device, comprising:
- a first device having a first pad;
- a second device having a second pad;
- and
- a bonding wire electrically connecting the first device and the second device to each other via the first pad and the second pad,
- wherein the bonding wire comprises:
- a first bonding structure provided at a first end of the bonding wire, electrically connected to the first device and comprising:
- a first ball bonding region;
- and
- a first stitch bonding region;
- and
- a second bonding structure provided at a second end opposite of the first end of the bonding wire and electrically connected to the second device.
A semiconductor device, comprising:
- a substrate comprising a substrate pad;
- a semiconductor chip mounted on the substrate and comprising a chip pad;
- and
- a bonding wire having a first end being connected to the substrate pad and a second end opposite to the first end being connected to the chip pad,
- wherein the first end of the bonding wire comprises a substrate bonding structure, the substrate bonding structure comprising:
- a first ball bonding region in which a first conductive ball is connected to the substrate pad;
- and
- a first stitch bonding region in which the bonding wire extends from the first conductive ball and is partially inserted into the substrate pad, and
- wherein the second end of the bonding wire comprises a chip bonding structure in which the bonding wire extends from the first stitch bonding region to come into electrical connection with the chip pad.
-23. (canceled)
A semiconductor device, comprising:
- a substrate comprising a first pad provided on the substrate;
- a chip provided on the substrate having a second pad provided on the chip;
- and
- a bonding wire connecting the substrate and the chip to each other via the first pad and the second pad,
- wherein the bonding wire comprises:
- a first bonding portion provided at a first end of the bonding wire and electrically connected to the substrate and comprising:
- a first bonding region;
- and
- a second bonding region;
- and
- a second bonding portion provided at a second end opposite of the first end of the bonding wire and electrically connected to the chip,
- wherein in the first bonding region, the bonding wire is ball-bonded to the substrate, and
- wherein in the second bonding region, the bonding wire is stitched to the substrate.
Dependencies are inferred from the claim text.