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US 2019/0157230 A1Published application
Multilayer pillar for reduced stress interconnect and method of making same
AssigneeInternational Business Machines Corporation
InventorsVirendra R. JADHAV, Krystyna W. SEMKOW, Kamalesh K. SRIVASTAVA, Brian R. SUNDLOF
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Abstract
A multi-layer pillar and method of fabricating the same is provided. The multi-layer pillar is used as an interconnect between a chip and substrate. The pillar has at least one low strength, high ductility deformation region configured to absorb force imposed during chip assembly and thermal excursions
Claims14
A method comprising:
- forming a first copper layer connected to the chip by a barrier and adhesion layer;
- forming a second copper layer connected to a via in the substrate by a solder layer;
- and
- forming an intermediate layer interposed between the first copper layer and the second copper layer, the intermediate layer having a modulus of elasticity less than copper;
- forming a first nickel layer between and contacting the first copper layer and the intermediate layer;
- and
- forming a second nickel layer between and contacting the second copper layer and the intermediate layer.
4 more elements
A method comprising:
- forming a barrier and adhesion layer that connects a modulated copper pillar to a chip;
- forming a seed layer contacting the barrier and adhesion layer;
- forming a first copper layer contacting the seed layer;
- forming a second copper layer contacting a solder material;
- forming at least one deformation region, wherein the at least one-deformation region is between the first copper layer and the second copper layer and has a modulus of elasticity less than copper;
- forming a first protective layer interposed at an interface between a surface of the at least one deformation region and the first copper layer, the first protective layer covering the entire surface;
- and
- forming a second protective layer interposed at an interface between a surface of the second copper layer and the at least one deformation region and the second copper layer, the second protective layer covering the entire surface of the at least one deformation region.
5 more elements
Dependencies are inferred from the claim text.