Conductive paste, electrode connection structure, and electrode connection structure production method

A conductive paste usable for electrical connection between a substrate and an electronic component mounted on the substrate,

• the conductive paste comprising a conductive powder and an alcoholic liquid component, the conductive paste containing no adhesives,
• wherein the conductive powder contains conductive particles having a thickness of 0.05 μm or more and 0.1 μm or less and a representative length of 5 μm or more and 10 μm or less, the representative length being a maximum diameter in a plane perpendicular to a direction of the thickness, and
• a weight percentage of the alcoholic liquid component in the conductive paste is 8% or more and 20% or less.