Semiconductor Structure and Method of Forming
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Yu-Hsiang Hu, Hung-Jui Kuo
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Abstract
A device package and methods of forming are provided. The device package includes a logic die and a first passivation layer over the logic die. The device package also includes a memory die and a molding compound extending along sidewalls of the logic die and the memory die. The device package also includes a conductive via extending through the molding compound, and a first redistribution layer (RDL) structure over the molding compound. The molding compound extends between a top surface of the memory die and a bottom surface of the first RDL structure. A top surface of the first passivation layer contacts the bottom surface of the first RDL structure.
Claims20
A package comprising:
- a first die;
- a first passivation layer overlying the first die;
- a second die adjacent the first die;
- a first insulating layer overlying the first die and the second die, wherein the first passivation layer is in physical contact with the first insulating layer;
- and
- a molding material extending along sidewalls of the first die, sidewalls of the second die and sidewalls of the first passivation layer, wherein the molding material extends between the second die and the first insulating layer.
A package comprising:
- a first die comprising a first electrical connector;
- a second die adjacent the first die, the second die comprising a second electrical connector;
- a molding material extending along sidewalls of the first die and sidewalls of the second die, wherein the molding material is in physical contact with sidewalls of the second electrical connector, and wherein sidewalls of the first electrical connector are separated from the molding material;
- and
- a first insulating layer over the first die and the second die, the first insulating layer being in physical contact with the first electrical connector, the second electrical connector and the molding material.
A package comprising:
- a first die comprising a first contact extending through a first passivation layer;
- a second die comprising a second contact extending through a second passivation layer;
- a third passivation layer overlying the first passivation layer and surrounding the first contact;
- a molding material extending between the first die and the second die, wherein the molding material is in physical contact with sidewalls of the first passivation layer, sidewalls of the second passivation layer, and sidewalls of the third passivation layer;
- and
- a first insulating layer overlying the first die and the second die, wherein the third passivation layer is in physical contact with the first insulating layer, and wherein the second passivation layer is separated from the first insulating layer by the molding material.
Dependencies are inferred from the claim text.