Method for Manufacturing Chip Cards and Chip Card Obtained by Said Method

A method for manufacturing a chip card, comprising:

• the production of a chip card module comprising a substrate having a first and a second main faces, with contacts on the first face of the substrate and bonding pads on the second face of the substrate, this module being also provided with an electronic chip connected to at least some contacts and to at least two conductive tracks dedicated to an antenna connection,
• the production of an antenna comprising two ends,
• the lamination of the antenna between layers of plastic material, and
• the placement of the module in a cavity formed in at least some of the layers of plastic material,
• the connection, using a soldering material deposited on a portion of connection of each of the ends of the antenna with a bonding pads of the module, and heated up, once the module is in place in the cavity,
• characterized by the fact that bonding pads are each produced on a zone covering a surface area less than that of a connection portion covered with soldering material.