Package with isolation structure
AssigneeNXP USA, Inc.
InventorsNishant LAKHERA, Andrew Jefferson MAWER, Akhilesh Kumar SINGH, Navas Khan ORATTI KALANDAR
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Abstract
Embodiments are provided herein for a packaged semiconductor device that includes a semiconductor die; a redistribution layer (RDL) structure on an active side of the semiconductor die, the RDL structure including a plurality of contact pads on an outer surface of the RDL structure; a plurality of external connections attached to the plurality of contact pads; and an isolation structure on the outer surface of the RDL structure around one or more contact pads of the plurality of contact pads, wherein a height of the isolation structure is at least two thirds of a height of the external connections.
Claims19
A packaged semiconductor device comprising:
- a package comprising:
- a semiconductor die, and a redistribution layer (RDL) structure on an active side of the semiconductor die;
- a plurality of contact pads on an outer surface of the RDL structure;
- a plurality of external connections attached to the plurality of contact pads;
- and
- an isolation structure on the outer surface of the RDL structure around a set of at least two contact pads of the plurality of contact pads, wherein a height of the isolation structure is at least two thirds of a height of the external connections.
12-20. (canceled)
Dependencies are inferred from the claim text.