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US 2019/0157220 A1Published application
Info Structure and Method Forming Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPo-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu
Life of this patent
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Abstract
A method includes encapsulating a package component in an encapsulating material, with the encapsulating material including a portion directly over the package component. The portion of the encapsulating material is patterned to form an opening revealing a conductive feature in the package component. A redistribution line extends into the opening to contact the conductive feature. An electrical connector is formed over and electrically coupling to the conductive feature.
Claims21
A method comprising:
- encapsulating a package component in an encapsulating material, wherein the encapsulating material comprises a first portion directly over the package component;
- patterning the first portion of the encapsulating material to form an opening revealing a conductive feature in the package component;
- forming a redistribution line extending into the opening to contact the conductive feature;
- and
- forming an electrical connector over and electrically coupling to the conductive feature.
2 more elements
A method comprising:
- attaching a device die to a base layer;
- encapsulating the device die in an encapsulating material, wherein the encapsulating material comprises a first portion directly over the device die, and a second portion encircling the first portion;
- patterning the first portion of the encapsulating material to form a first opening revealing a conductive feature in the device die;
- patterning the second portion of the encapsulating material to form a second opening revealing the base layer;
- forming a redistribution line extending into the first opening;
- and
- forming a seal ring extending into the second opening.
4 more elements
16-20. (canceled)
A method comprising:
- forming a dielectric layer over a carrier;
- attaching a device die over the dielectric layer;
- encapsulating the device die in an encapsulating material;
- patterning the encapsulating material to form a first opening penetrating through the encapsulating material, wherein the dielectric layer is exposed through the first opening;
- and
- forming a conductive feature, wherein the conductive feature comprises a first portion overlapping the encapsulating material, and a second portion extending into the first opening to contact the dielectric layer.
3 more elements
Dependencies are inferred from the claim text.