Interposer and method for producing holes in an interposer
AssigneeSchott AG
InventorOliver JACKL
Life of this patent
Estimating the term…
Abstract
An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a plate-shaped base substrate made of glass with a number of holes ranging from 10 to 10.000 cm−2. Conductive paths run on one surface of the board, extend into respective holes, and extend through the holes to the other surface of the plate in order to form connection points for the chip. The holes are produced in two steps: first filamentary channels are prepared, and second the filamentary channels are widened by etching so as to get typical roughness as from etching.
Claims23
An interposer assembly, comprising:
- a CPU chip;
- a circuit board;
- a board-shaped base substrate made of glass forming a first interposer surface and a second interposer surface, the base substrate having a coefficient of thermal expansion ranging from 2.8×10−6/K to 3.8×10−6/K, the base substrate having a number of holes transversely to the first and second interposer surfaces, the number of holes ranging from 10 to 10,000, the holes comprising diameters ranging from 20 μm to 200 μm, and the holes comprising a center-to-center distance in a range from 50 μm to 700 μm;
- and
- conductive paths running on the first interposer surface, extending into the holes, and extending through the holes to the second interposer surface to form connection points for the CPU chip,
- wherein the CPU chip and the circuit board are directly connected to the first and second interposer surfaces.
An interposer assembly, comprising:
- a CPU chip;
- a circuit board;
- a board-shaped base substrate made of a single layer of glass and forming a first interposer surface and a second interposer surface;
- a number of holes extending through a thickness of the base substrate transversely to the first and second interposer surfaces, the number of holes having inner walls with cylindrical shape, the inner walls having an etched roughness, the number of holes each having a conical or crater-shaped inlet and outlet or a transition zone with rounded edges between the inner wall and the first and second interposer surfaces, respectively;
- and
- conductive material filling the number of holes, wherein the CPU chip and the circuit board are directly connected to the first and second interposer surfaces, respectively.
A glass plate of a single layer with a number of holes extending through the plate thickness from a first plate surface to a second plate surface, the glass plate being adapted as a substrate for producing interposers, wherein the holes have been produced by preparing local non-thermal destruction of the glass along respective filamentary channels in the glass by triggering focused laser pulses in a wavelength range in which the glass is at least partially transparent, and widening the filamentary channels to the desired diameter of the holes by etching such that the holes get a cylindrical shape along its length and with inner walls having typical roughness as from etching.
An interposer assembly, comprising:
- a CPU chip;
- a circuit board;
- a board-shaped base substrate made of glass forming a first interposer surface and a second interposer surface, the base substrate having a coefficient of thermal expansion ranging from 2.8×10−6/K to 3.8×10−6/K, the base substrate, transversely to the first and second interposer surfaces, having a number of holes which, starting from respective filamentary channels through the board-shaped base substrate, are widened as a result from etching, with a cylindrical inner wall in a hole center and with a conical or crater-shaped inlet or outlet to the hole, or a transition zone with rounded edges between inner wall and first and second interposer surfaces, respectively, the holes having a roughness as a result from etching, the number of holes ranging from 10 to 10,000, the holes comprising diameters ranging from 20 μm to 200 μm, and the holes comprising a center-to-center distance in a range from 50 μm to 700 μm;
- and
- conductive paths running on the first interposer surface, extending into the holes, and extending through the holes to the second interposer surface to form connection points for the CPU chip, wherein the CPU chip and the circuit board are directly connected to the first and second interposer surfaces.
An interposer assembly, comprising:
- a CPU chip;
- a circuit board;
- a board-shaped base substrate made of a single layer of glass and forming a first interposer surface and a second interposer surface;
- a number of holes extending through a thickness of the base substrate transversely to the first and second interposer surfaces, the holes having inner walls with cylindrical shape as from etching filamentary channels through the base substrate, and a transition zone with rounded edges between the inner wall and the first and second interposer surfaces, respectively, as from etching the holes having an etched roughness;
- and
- conductive filling material filling the holes, wherein the CPU chip and the circuit board are connected to the conductive filling material on the first and second interposer surfaces, respectively.
A glass plate of a single layer with a number of holes extending through the plate thickness from a first plate surface to a second plate surface, the glass plate being adapted as a substrate for producing interposers, wherein the holes have been produced by preparing respective filamentary channels in the glass and widening the filamentary channels to a desired diameter of the holes by etching such that the holes get a cylindrical shape along its length and with rounded edges between the inner cylindrical walls of the holes and the outer first and second plate surfaces the hole walls having typical roughness as from etching.
Dependencies are inferred from the claim text.