Hybrid composite film, method of fabricating the same, and integrated circuit device including hybrid composite film

A method of fabricating a hybrid composite film, the method comprising:

• forming a plurality of inorganic particles;
• forming a plurality of organic-inorganic composite particles by forming an organic capping layer on a surface of each particle of the plurality of inorganic particles, the organic capping layer having a hydroxyl group-terminated end;
• forming an organic-inorganic composite particle-dispersed solution by dispersing the plurality of organic-inorganic composite particles in a solvent;
• forming a liquid mixture of the organic-inorganic composite particle-dispersed solution with a polymer precursor composition;
• forming a coating film from the liquid mixture;
• and
• curing the coating film.

An integrated circuit device, comprising:

• a semiconductor device;
• and
• a hybrid composite film covering the semiconductor device,
• wherein the hybrid composite film includes a polymer film and a plurality of organic-inorganic composite particles dispersed in the polymer film, and
• each particle of the plurality of organic-inorganic composite particles includes an inorganic particle and an organic capping layer surrounding the inorganic particle, the organic capping layer having a hydroxyl group-terminated end.