Shielded package with integrated antenna

A method for forming a semiconductor structure, comprising:

• forming an encapsulant over a device and surrounding a conductive pillar, wherein the conductive pillar extends from a first major surface of the encapsulant to a second major surface of the encapsulant, opposite the first major surface, and is exposed at the second major surface of the encapsulant and the at least one device is exposed at the first major surface of the encapsulant;
• forming a redistribution layer on the first major surface of the encapsulant and the exposed device;
• applying a conductive paste on the exposed conductive pillar at the second surface of the encapsulant;
• forming a shield layer over the second major surface of the encapsulant, wherein the shield layer is electrically isolated from the conductive pillar by an isolation region;
• and
• attaching a radio-frequency (RF) connector over the conductive pillar such that the RF connector is in electrical contact with the conductive pillar at the second major surface of the encapsulant, and the RF connector is configured to couple to an antenna.

A method for forming a semiconductor structure, comprising:

• forming an encapsulant over a device and surrounding a conductive pillar, wherein the conductive pillar extends from a first major surface of the encapsulant to a second major surface of the encapsulant, opposite the first major surface, and is exposed at the second major surface of the encapsulant and the at least one device is exposed at the first major surface of the encapsulant;
• forming a redistribution layer on the first major surface of the encapsulant and the exposed device;
• singulating the encapsulant to form a singulated packaged device having the device and conductive pillar;
• forming a shield layer over the second major surface and minor surfaces of the encapsulant of the singulated package device;
• cutting the shield layer at the second major surface of the encapsulant of the singulated package device to form a first portion of the shield layer that is electrically isolated from the conductive pillar and a second portion of the shield layer that remains over the conductive pillar;
• applying an electrically conductive adhesive to the second portion of the shield layer;
• and
• attaching a radio-frequency (RF) connector over the conductive pillar such that the RF connector is in electrical contact with the conductive pillar via the electrically conductive adhesive and second portion of the shield layer, and the RF connector is configured to couple to an antenna.