Systems and methods for electromagnetic interference shielding
AssigneeIntel Corporation
InventorsRajendra C. Dias, Mitul B. Modi
Life of this patent
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Abstract
Discussed generally herein are methods and devices including or providing an electromagnetic interference (EMI) shielding. A device can include substrate including electrical connection circuitry therein, ground circuitry on, or at least partially in the substrate, the ground circuitry at least partially exposed by a surface of the substrate, a die electrically connected to the connection circuitry and the ground circuitry, the die on the substrate, a conductive material on a die backside, and a conductive paste or one or more wires electrically connected to the ground circuitry and the conductive material.
Claims20
A device with electromagnetic interference (EMI) shielding, the device comprising:
- a substrate including electrical connection circuitry therein;
- ground circuitry on, or at least partially in, the substrate;
- a die electrically connected to the electrical connection circuitry and the ground circuitry, the die on the substrate;
- a conductive foil, conductive film, or conductive paste on and covering a die backside and one or more sides of the die, and partially covering an active side of the die, the active side of the die opposite the die backside, the sides of the die extending between the active side and the die backside;
- one or more undercuts forming a void on an active side and a side of the die, the active side interfacing with the substrate;
- and
- wherein the conductive foil, conductive film, or conductive paste fills the one or more undercuts.
A device with electromagnetic interference (EMI) shielding, the device comprising:
- a substrate;
- ground circuitry on, or at least partially in, the substrate;
- a die electrically connected to the ground circuitry;
- a conductive foil, conductive film, or conductive film on and covering a die backside and one or more sides of the die, and partially covering an active side of the die, the active side of the die opposite the die backside, the sides of the die extending between the active side and the die backside;
- one or more undercuts forming a void on an active side and a side of the die, the active side interfacing with the substrate;
- and
- wherein the conductive foil, conductive film, or conductive paste at least partially fills the one or more undercuts.
Dependencies are inferred from the claim text.