Package structures

A package structure, comprising:

• at least one integrated circuit component, comprising:
• a semiconductor substrate;
• an interconnection structure, disposed on the semiconductor substrate;
• signal terminals, located on and electrically connecting to the interconnection structure;
• and
• power terminals, located on and electrically connecting to the interconnection structure, wherein a size of at least a portion of the power terminals is greater than a size of the signal terminals, and the interconnection structure is located between the semiconductor substrate and the signal terminals and between the semiconductor substrate and the power terminals;
• an insulating encapsulation, encapsulating the at least one integrated circuit component;
• and
• a redistribution structure, located on the insulating encapsulation and electrically connected to the at least one integrated circuit component.

A package structure, comprising:

• at least one integrated circuit component, comprising:
• a semiconductor substrate;
• an interconnection structure, disposed on the semiconductor substrate;
• and
• signal connecting vias, ground connecting vias and at least one power connecting via, located on and electrically connecting to the interconnection structure, wherein the interconnection structure is located between the semiconductor substrate and the signal connecting vias, between the semiconductor substrate and the ground connecting vias, and between the semiconductor substrate and the at least one power connecting via, wherein a first size of the signal connecting vias is less than a second size of the at least one power connecting via;
• an insulating encapsulation, encapsulating the at least one integrated circuit component;
• and
• a redistribution structure, located on the insulating encapsulation and electrically connected to the at least one integrated circuit component.