Back to results
US 2019/0157199 A1Published application
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
AssigneeInvensas Corporation
InventorsCyprian Emeka UZOH, Charles G. WOYCHIK, Arkalgud R. SITARAM, Hong Shen, Zhuowen SUN, Liang WANG, Guilian GAO
Life of this patent
Estimating the term…
Abstract
In a microelectronic component having conductive vias (114) passing through a substrate (104) and protruding above the substrate, one or more conductive features (120E.A, 120E.B, or both) are provided above the substrate that wrap around the conductive vias' protrusions (114′) to form capacitors, electromagnetic shields, and possibly other elements. Other features and embodiments are also provided.
Claims19
A microelectronic component comprising:
- a substrate comprising one or more first through-holes;
- one or more conductive vias, each conductive via comprising a portion inside a corresponding first through-hole, and comprising a conductive protrusion protruding from the corresponding first through-hole for attachment to circuitry outside the microelectronic component;
- for each conductive protrusion:
- a first dielectric region wrapping around the conductive protrusion and covering the corresponding first through-hole adjacent to the conductive protrusion;
- and
- a first conductive sleeve region wrapping around the conductive protrusion, the first conductive sleeve region being separated from the corresponding first through-hole and the conductive protrusion by the corresponding first dielectric region;
- wherein the microelectronic component is configured to operate with the first conductive sleeve region receiving a voltage to act as an electromagnetic shield for the conductive protrusion.
4 more elements
A microelectronic component comprising:
- a substrate comprising one or more first through-holes;
- one or more conductive vias, each conductive via comprising a portion inside a corresponding first through-hole, and comprising a conductive protrusion protruding from the corresponding first through-hole for attachment to circuitry outside the microelectronic component;
- for each conductive protrusion, a first dielectric region wrapping around the conductive protrusion and covering the corresponding first through-hole adjacent to the conductive protrusion;
- and
- a conductive layer comprising, for each conductive protrusion, a first conductive sleeve region wrapping around the conductive protrusion, the first conductive sleeve region being separated from the corresponding first through-hole and the conductive protrusion by the corresponding first dielectric region;
- wherein the conductive layer covers the substrate except for an area surrounded by any first conductive sleeve region;
- wherein the microelectronic component is configured to operate with the conductive layer receiving a voltage to act as an electromagnetic shield for the substrate.
4 more elements
A microelectronic component comprising:
- a substrate comprising one or more first through-holes;
- one or more conductive vias, each conductive via comprising a portion inside a corresponding first through-hole, and comprising a conductive protrusion protruding from the corresponding first through-hole for attachment to circuitry outside the microelectronic component;
- for each conductive protrusion:
- a first dielectric region wrapping around the conductive protrusion and covering the corresponding first through-hole adjacent to the conductive protrusion;
- and
- a first conductive sleeve region wrapping around the conductive protrusion, the first conductive sleeve region being separated from the corresponding first through-hole and the conductive protrusion by the corresponding first dielectric region;
- wherein the microelectronic component is configured to operate with the first conductive sleeve region receiving a constant voltage.
4 more elements
Dependencies are inferred from the claim text.