Semiconductor device package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsJen-Kuang FANG, Wen-Long LU
Life of this patent
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Abstract
A semiconductor device package includes an electronic component, a first substrate, a first bonding wire and a second substrate. The electronic component has a first surface. The first substrate is disposed on the first surface of the electronic component. The first bonding wire electrically connects the first substrate to the electronic component. The second substrate is disposed on the first surface of the electronic component. The second substrate defines an opening accommodating the first substrate and the first bonding wire.
Claims20
A semiconductor device package, comprising:
- an electronic component having a first surface;
- a first substrate disposed on the first surface of the electronic component;
- a first bonding wire electrically connecting the first substrate to the electronic component;
- and
- a second substrate disposed on the first surface of the electronic component, the second substrate defining an opening accommodating the first substrate and the first bonding wire.
A semiconductor device package, comprising:
- an electronic component having a first surface;
- a first substrate disposed on the first surface of the electronic component;
- a first bonding wire electrically connecting the first substrate to the electronic component;
- and
- a second substrate disposed on the first surface of the electronic component, the second substrate surrounding the first substrate and being separated from the first substrate.
A method of manufacturing a semiconductor device package, comprising:
- providing an electronic component, a first substrate and a second substrate;
- disposing the first substrate on the electronic component;
- bonding a first wire to electrically connect the first substrate to the electronic component;
- disposing the electronic component on the second substrate;
- and
- bonding a second wire to electrically connect the second substrate to the first substrate.
Dependencies are inferred from the claim text.