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US 2019/0157196 A1Published application
Lead frame and semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorsKesayuki SONEHARA, Muneaki KURE, Yosuke ARUGA
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Abstract
A lead frame includes a conductive member, a plating layer, and an oxide film. The conductive member includes a rough surface. The plating layer is formed on the rough surface and configured to be connected to a semiconductor element. The oxide film covers the rough surface at least around the plating layer.
Claims13
A lead frame comprising:
- a conductive member including a rough surface;
- a plating layer formed on the rough surface and configured to be connected to a semiconductor element;
- and
- an oxide film covering the rough surface at least around the plating layer.
1 more element
A semiconductor device comprising:
- a semiconductor element including an electrode;
- a lead including
- a conductive member including a rough surface,
- a plating layer formed on the rough surface, and
- an oxide film covering the rough surface at least around the plating layer;
- solder connecting the electrode to the plating layer;
- and
- an encapsulation resin covering the semiconductor element, the solder, and part of the lead.
5 more elements
A semiconductor device comprising:
- a semiconductor element including an electrode;
- a lead;
- a die pad including
- a conductive member including a rough surface,
- a plating layer formed on the rough surface, and
- an oxide film covering the rough surface at least around the plating surface;
- solder connecting the semiconductor element and the plating layer;
- a wire connecting the electrode of the semiconductor element to the lead;
- and
- an encapsulation resin covering the semiconductor element, the die pad, the solder, the wire, and part of the lead.
7 more elements
Dependencies are inferred from the claim text.