Packaged semiconductor device with a particle roughened surface
AssigneeTexas Instruments Incorporated
InventorsVikas Gupta, Daniel Yong Lin
Life of this patent
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Abstract
A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame. A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame and with a reflow wall that surrounds a portion of the solder joint that couples the semiconductor device to the lead frame. A packaged semiconductor device with a reflow wall that surrounds a portion of a solder joint that couples a semiconductor device to a lead frame.
Claims20
A packaged semiconductor device comprising:
- a substrate;
- a semiconductor device electrically connected to the substrate;
- a particle roughened surface on a portion of a surface of the substrate and comprised of a first polymer containing first particles;
- and
- molding compound covering portions of the semiconductor device, the substrate, and the particle roughened surface.
A packaged semiconductor device comprising:
- a substrate;
- a semiconductor device electrically connected to the substrate;
- a particle roughened surface formed of ink residue on a portion of a surface of the substrate and comprised of a first polymer containing first particles;
- and
- molding compound covering portions of the semiconductor device, the substrate, and the particle roughened surface.
A packaged semiconductor device comprising:
- a substrate;
- and
- a semiconductor device electrically connected to the substrate via a connection mechanism, the connection mechanism including a solder and reflow side walls surrounding solder including particles in a first polymer, and a solder pad at an interface between the solder and the substrate, the solder pad including particles dispersed in solder flux.
Dependencies are inferred from the claim text.