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US 2019/0157193 A1Published application
Semiconductor device and method for manufacturing semiconductor device
AssigneeRohm Co., Ltd.
InventorsAKIHIRO KIMURA, TAKESHI SUNAGA, SHOUJI YASUNAGA, AKIHIRO KOGA
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Abstract
A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
Claims66
A semiconductor device, comprising:
- a first island part;
- a first semiconductor chip mounted on the first island part;
- a second island part;
- a second semiconductor chip mounted on the second island part;
- a third island part;
- a third semiconductor chip mounted on the third island part;
- a fourth island part;
- a fourth semiconductor chip mounted on the fourth island part;
- a fifth semiconductor chip mounted on the fourth island part;
- a sixth semiconductor chip mounted on the fourth island part;
- a fifth island part;
- a first driving semiconductor chip mounted on the fifth island part and connected to each of the first to third semiconductor chips;
- a sixth island part;
- a second driving semiconductor chip mounted on the sixth island part and connected to each of the fourth to sixth semiconductor chips;
- a first lead terminal connected to the first semiconductor chip by a first wire;
- a second lead terminal connected to the second semiconductor chip by a second wire;
- a third lead terminal connected to the third semiconductor chip by a third wire;
- a fourth lead terminal connected to the fourth semiconductor chip by a fourth wire;
- a fifth lead terminal connected to the fifth semiconductor chip by a fifth wire;
- a sixth lead terminal connected to the sixth semiconductor chip by a sixth wire;
- and
- a seventh lead terminal extending from the fourth island part,
- wherein the first to sixth semiconductor chips are arranged in a first direction,
- the first lead terminal is longer than the second lead terminal in a second direction perpendicular to the first direction, and
- the second lead terminal is longer than the third lead terminal in the second direction.
22 more elements
A semiconductor device, comprising:
- a first island part;
- a first semiconductor chip mounted on the first island part;
- a second island part;
- a second semiconductor chip mounted on the second island part;
- a third island part;
- a third semiconductor chip mounted on the third island part;
- a fourth island part;
- a first driving semiconductor chip mounted on the fourth island part and connected to each of the first to third semiconductor chips;
- a first lead terminal connected to the first semiconductor chip by a first wire;
- a second lead terminal connected to the second semiconductor chip by a second wire;
- and
- a third lead terminal connected to the third semiconductor chip by a third wire,
- wherein the first to third semiconductor chips are arranged in a first direction,
- the first lead terminal is longer than the second lead terminal in a second direction perpendicular to the first direction, and the second lead terminal is longer than the third lead terminal in the second direction.
11 more elements
Dependencies are inferred from the claim text.