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US 2019/0157192 A1Published application
Package with interconnections having different melting temperatures
AssigneeInfineon Technologies AG
InventorsAndreas Grassmann, Juergen Hoegerl, Angela Kessler, Ivan Nikitin
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Abstract
A package comprising at least one electronic chip, a first heat removal body on which the at least one electronic chip is mounted by a first interconnection, a second heat removal body mounted on or above the at least one electronic chip by a second interconnection, and an encapsulant encapsulating at least part of the at least one electronic chip, part of the first heat removal body and part of the second heat removal body, wherein the first interconnection is configured to have another melting temperature than the second interconnection.
Claims18
A package, comprising:
- at least one electronic chip;
- a first heat removal body on which the at least one electronic chip is mounted by a first interconnection;
- a second heat removal body mounted on or above the at least one electronic chip by a second interconnection;
- at least one electrically conductive spacer body between the at least one electronic chip and the second heat removal body;
- a third interconnection which directly connects the at least one spacer body with the second heat removal body;
- wherein the first interconnection, the second interconnection and the third interconnection are each configured to have different melting temperatures.
3 more elements
Dependencies are inferred from the claim text.