Semiconductor package with integrated passive electrical component
AssigneeTexas Instruments Incorporated
InventorsJoyce Marie MULLENIX, Roberto Giampiero MASSOLINI, Rajeev D. JOSHI
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Abstract
A semiconductor package includes a leadframe comprising input/output pins accessible external to the semiconductor package and a semiconductor die electrically connected to the leadframe. The semiconductor package also includes a passive electrical component mounted on a side of the semiconductor die opposite the leadframe. Mold compound encapsulates the passive electrical component, semiconductor die, and leadframe to form the semiconductor package. Associated methods are disclosed as well.
Claims20
A semiconductor package, comprising:
- a leadframe comprising input/output pins accessible external to the semiconductor package;
- a semiconductor die electrically connected to the leadframe;
- a passive electrical component mounted on a side of the semiconductor die opposite the leadframe to sandwich the semiconductor die between the passive electrical component and the leadframe, the passive electrical component including a conductive element connected to the leadframe through a solder ball, wherein the conductive element:
- spans parallel to the leadframe;
- or is sandwiched between a pair of magnetic elements;
- and
- mold compound encapsulating the passive electrical component, the semiconductor die and the leadframe to form the semiconductor package.
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A method, comprising:
- forming a first magnetic material on a first surface of a conductive loop;
- forming a second magnetic material on a second surface of the conductive loop opposite the first surface to form an inductor;
- attaching a semiconductor die to a leadframe;
- and
- attaching the inductor to the leadframe with solder balls, wherein the semiconductor die is sandwiched between the inductor and the leadframe, and the conductive loop:
- spans parallel to the leadframe;
- or is sandwiched between the first magnetic material and the second magnetic material.
A semiconductor package, comprising:
- a leadframe comprising input/output pins accessible external to the semiconductor package;
- a semiconductor die electrically connected to the leadframe;
- an inductor comprising a conductive element sandwiched between a pair of magnetic elements, wherein the inductor is electrically connected to the leadframe with solder balls so that the inductor is mounted on a side of the semiconductor die opposite the first leadframe;
- and
- mold compound encapsulating the inductor, the semiconductor die and the leadframe to form the semiconductor package.
Dependencies are inferred from the claim text.