Power semiconductor module, power conversion device using same, and method for manufacturing power conversion device
AssigneeHitachi Automotive Systems, Ltd.
InventorsNobutake TSUYUNO, Morio KUWANO, Takeshi TOKUYAMA
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Abstract
Provided is a compact power conversion device which is excellent in liquid tightness and has high reliability of a terminal connection portion. A power conversion device according to the present invention includes: a case that houses a power semiconductor; a flow path forming body that forms a flow path with an outer surface of the case; a first fixing material in contact with a refrigerant flowing in the flow path; and a second fixing material that is in contact with the first fixing material and the flow path forming body and covers a direction of displacement of the case of the first fixing material caused by water pressure.
Claims14
A power semiconductor module comprising:
- a case that houses a power semiconductor and is fixed to a flow path forming body;
- a first fixing material in contact with a refrigerant;
- and
- a second fixing material that is in contact with the first fixing material and the flow path forming body and covers a direction of displacement of the case of the first fixing material caused by water pressure.
A method for manufacturing a power conversion device comprising:
- a first step of housing a case that houses a power semiconductor in a flow path of a flow path forming body;
- a second step of arranging a first fixing material so as to come into contact with a refrigerant flowing in the flow path;
- and
- a third step of arranging a second fixing material so as to come into contact with the first fixing material and the flow path forming body and cover a direction of displacement of the case of the first fixing material caused by water pressure,
- wherein the first fixing material or the second fixing material, or the first fixing material and the second fixing material are formed by curing a liquid resin.
Dependencies are inferred from the claim text.